JPH0170332U - - Google Patents

Info

Publication number
JPH0170332U
JPH0170332U JP16598987U JP16598987U JPH0170332U JP H0170332 U JPH0170332 U JP H0170332U JP 16598987 U JP16598987 U JP 16598987U JP 16598987 U JP16598987 U JP 16598987U JP H0170332 U JPH0170332 U JP H0170332U
Authority
JP
Japan
Prior art keywords
high viscosity
paste material
viscosity paste
closed container
pressurizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16598987U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16598987U priority Critical patent/JPH0170332U/ja
Publication of JPH0170332U publication Critical patent/JPH0170332U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP16598987U 1987-10-29 1987-10-29 Pending JPH0170332U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16598987U JPH0170332U (en]) 1987-10-29 1987-10-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16598987U JPH0170332U (en]) 1987-10-29 1987-10-29

Publications (1)

Publication Number Publication Date
JPH0170332U true JPH0170332U (en]) 1989-05-10

Family

ID=31452972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16598987U Pending JPH0170332U (en]) 1987-10-29 1987-10-29

Country Status (1)

Country Link
JP (1) JPH0170332U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008178892A (ja) * 2007-01-23 2008-08-07 Canon Machinery Inc 半田供給装置および半田供給方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008178892A (ja) * 2007-01-23 2008-08-07 Canon Machinery Inc 半田供給装置および半田供給方法

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